From Application Decoration Products

PICASUS*

PICASUS*

Metallic Luster Forming Film

An entirely new film with metallic luster without using metal

Items: Environment-friendliness, light transmittance, electromagnetic wave transmission, formability

Focus: To develop a film with superior properties of environment-friendliness, light transmittance, electromagnetic wave transmission and formability by not using metal

Impacts: We were able to achieve metallic luster and light transmittance with innovation of film structure alone. The film can replace plating, coating and metal vapor deposition.

Features

Feature of the metallic luster forming film: metal free

1. Environmental aspect → free from metal plating and coating, recyclable
2. Electromagnetic wave transmission → does not block electromagnetic waves
3. Formability → free of cracks and blanching
4. Simple process → simultaneous forming and decorative carving enabled by insert molding
5. Diversified design possibilities → various designs can be added at the film phase
6. Corrosiveness → no possibility of corrosion because since no metal is involved

Formability

Film design & Key technology

Processing method

Insert Forming Processing method Processing Conditions
Metallic Luster, Half-Mirror Processing method  
Brushed Processing method  
Mat Processing method  

Application

Mobile Phone / Automotive / Mobile Player / PC / electronics / Amusement / IC Card

Types & Properties

  100GH30 100GM30 100GL30 100GT30 145GB30S
Thickness(*1) μm 100 100 100 100 145
Brightness L* 87 75 64 42 55
Color tone (*2) a*,b* -1.0,0.0 -4.0,5.0 -4.0,6.0 -2.0,4.0 -26,-28
Total luminous
transmittance (*3)
% 30 50 65 85 75
Stress @ break
point(MD/TD)(*4)
MPa 140/150 130/150 140/160 160/190 160/200
Elongation @ break
point(MD/TD)(*4)
% 190/140 200/150 190/150 180/140 200/120
Heat Shrinkage
(MD/TD)(*5)
% 1.0/0.6 1.0/0.4 1.0/0.5 1.1/0.7 1.0/0.6
Loss @ 2.4GHz (*6) dB <1 <1 <1 <1 <1
Adhesion
(for ink, HC)
- Both sides Both sides Both sides Both sides Both sides
Print

<Method of mesurement>
*1) Micrometer(JIS C2151), *2) CIE L*a*b*(JIS Z8722, refection),
*3) Haze meter(JIS K7105) , *4) Tensilon(JIS C2151), *5) 150℃×30min(Toray Method)
*6) Coaxial tube type Effect of shield measurement system (ASTM D4935)

This properties is representative values and may be changed without a notice.

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““PICASUS””
  100GH30 100GM30 100GL30 100GT30 145GB30S
Thickness(*1) μm 100 100 100 100 145
Brightness L* 87 75 64 42 55
Color tone (*2) a*,b* -1.0,0.0 -4.0,5.0 -4.0,6.0 -2.0,4.0 -26,-28
Total luminous
transmittance (*3)
% 30 50 65 85 75
Stress @ break
point(MD/TD)(*4)
MPa 140/150 130/150 140/160 160/190 160/200
Elongation @ break
point(MD/TD)(*4)
% 190/140 200/150 190/150 180/140 200/120
Heat Shrinkage
(MD/TD)(*5)
% 1.0/0.6 1.0/0.4 1.0/0.5 1.1/0.7 1.0/0.6
Loss @ 2.4GHz (*6) dB <1 <1 <1 <1 <1
Adhesion
(for ink, HC)
- Both sides Both sides Both sides Both sides Both sides

<Method of mesurement>
*1) Micrometer(JIS C2151), *2) CIE L*a*b*(JIS Z8722, refection),
*3) Haze meter(JIS K7105) , *4) Tensilon(JIS C2151), *5) 150℃×30min(Toray Method)
*6) Coaxial tube type Effect of shield measurement system (ASTM D4935)

This properties is representative values and may be changed without a notice.

Print
Processing Conditions

Printing

MELF is available in Printing process as well as Lumirror, biaxial oriented film.
Please see the typical recommendable condition for printing for insert forming as below.

Screen Ink Teikoku Printing Inks Mfg. Co., Ltd. (JAPAN)
CaiHuang (Shanghai) Fine Chemical Co., Ltd. (China)
IPX Ink or INQ ink
Binder Teikoku Printing Inks Mfg. Co., Ltd. (JAPAN)
CaiHuang (Shanghai) Fine Chemical Co., Ltd. (China)
IMB-003
Press Plate T-200 to T-270 mesh
Solvent Teikoku F-003 solvent 10 to 15%
Catalyst Teikoku 200 catalyst 16% (IPX)
Teikoku 200 catalyst 6% (INQ)
Drying [Initial drying] 80°C 10min. - [Final drying] 90°C 60min.

Pre-forming

Please see the typical condition for each pre-forming processes as below.

1)Vacuum / Pressure forming

Machine Asano Laboratories,Inc.
Forming temp. From 200 to 230°C (film temp.)
Pressure and above 0.5 MPa
Die temp. From 80 to 100°C

2)Press forming

Pressure over 2 MPa
Die temp. From 60 to 100°C
Pressure time From 10 to 20 sec.

Insert Molding

Please see the typical plastic material suitable for insert molding as below.

Plastic materials PC, PC/ABS, ABS, PMMA